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Full Description JEDEC JEP155B was written with the intent to provide information fo..

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Full Description This publication references a set of frequently recommended and acc..

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Full Description This publication references a set of frequently recommended and acc..

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Full Description This document was written with the intent to provide information fo..

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Full Description To increase device bandwidth, reduce power and shrink form factor, ..

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Full Description This document is intended for use in the semiconductor IC manufactu..

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Full Description This document is intended for use in the semiconductor IC manufactu..

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Full Description This publication examines the LTS requirements of wafers, dice, and..

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Full Description JEP162, while establishing the complex nature of System Level ESD, ..

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Full Description JEP162A, while establishing the complex nature of System Level ESD,..

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Full Description This publication is intended as a guideline to develop and establis..

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Full Description This document defines the JC-42.6 Manufacturer ID. This document co..

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Full Description This document defines the JC-42.6 Manufacturer ID. This document co..

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Full Description This document identifies methods used for the characterization of d..

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Full Description This document identifies methods used for the characterization of d..

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Full Description This publication provides description of defects observed in FCxGA ..

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